3.2 mm x 5.0 mm ceramic package smd vcxo, ttl / hc-mos i604 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 08/11 specifications subjec t to change without notice p age 1 recommended pad layout dimension units: mm pin connection 1 v control 2 e/d(n.c.) 3 gnd 4 output 5 n.c.(e/d) 6 v dd product features: applications: small surface mount package sd/hd video cmos/ttl compatible logic levels sonet /sdh compatible with leadfree processing voip t1/e1, t3/e3 base station frequency 77.760 mhz to 200.000 mhz output level (hcmos) v oh = 90% vdd min. v ol = 10% vdd max. duty cycle 50% 10% std.(5% optional) rise / fall time 10.0 ns max. output load 15pf frequency stability see table below start-up time 10 ms max. supply voltage see input voltage table, tolerance 5 % control voltage 1.25 vdc 1.05 vdc for 2.5 vdc, 1.65 vdc 1.35 vdc for 3.3 vdc, 2.5 vdc 2.0 vdc for 5.0 vdc pull range 100 ppm min. (std). see table below. current 50.0 ma max. enable/disable(pin 2 or pin 5) 70% vdd min. / 30%vdd max. linearity 10% aging 5ppm/year max. (3ppm optional) phase jitter (12khz to 20khz) 6.0 ps max. period jitter (pk-pk) 100ps max. temperature operating storage see below -55 ? c to +125 ? c note: a 0.01 f bypass capacitor is recommended between vcc (pin 6) and gnd (pin 3) to minimize power supply noise. * not avai lable at all voltages. part number guide sample part number: i604-1bc3h2-77.760 package operating temperature stability (in ppm) pullability supply voltage enable / disable frequency i604 - 1 = 0 ? c to +70 ? c f = ? 20 b = ? 50 ppm min. 5 = 5.0 vdc h2 = enable(pin 2) - 77.760 mhz 2 = -40 ? c to +85 ? c a = ? 25 c = ? 100 ppm min.* 3 = 3.3 vdc h5 = enable(pin 5) b = ? 50 k = ? 150 ppm min.* 6 = 2.5 vdc
3.2 mm x 5.0 mm ceramic package smd vcxo, ttl / hc-mos i604 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 08/11 specifications subjec t to change without notice p age 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e4 (au over ni over w base metalization). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: ilsi and date code line 2: frequency quantity per reel 1000 a 16 +/-.3 b 8 +/-.2 c 7.5 +/-.2 d 17.5 +/-1 e 50 / 60 / 80 f 180 / 250
|
